Planar Deposition of Aluminum by RF/DC Sputtering with RF Bias

• 1 June 1985
• journal article
• Published by The Electrochemical Society in Journal of the Electrochemical Society
• Vol. 132  (6) , 1466-1472
• https://doi.org/10.1149/1.2114145

Abstract

Keywords

• COMPUTER SIMULATION
• ASPECT RATIO