Room temperature tensile properties of Sn-5%Sb solder
- 1 January 1994
- journal article
- Published by Springer Nature in Journal of Materials Science Letters
- Vol. 13 (19) , 1387-1389
- https://doi.org/10.1007/bf00405039
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Solder Paste in Electronics PackagingPublished by Springer Nature ,1989