Deformation Mechanisms in Tin and Tin-Based Electronic Solder Alloys

• 12 October 1999
• journal article
• Published by Trans Tech Publications, Ltd. in Key Engineering Materials
• Vol. 171-174, 655-662
• https://doi.org/10.4028/www.scientific.net/kem.171-174.655

Abstract

Keywords

• ACTIVATION ENERGY
• CREEP
• SN-3.5AG
• SN-5SB
• SOLDER
• TITANIUM NITRIDE TIN