Reactive sputter etching of Si, SiO2, Cr, Al, and other materials with gas mixtures based on CF4 and Cl2
- 1 November 1981
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science and Technology
- Vol. 19 (4) , 1408-1411
- https://doi.org/10.1116/1.571220
Abstract
No abstract availableThis publication has 0 references indexed in Scilit: