Three-dimensional passive circuit technology for ultra-compact MMICs
- 19 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1447-1450 vol.3
- https://doi.org/10.1109/mwsym.1995.406245
Abstract
A novel passive circuit technology of a three-dimensional (3D) metal-insulator structure has been developed for ultra-compact MMICs. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling and a pillar-like via connection, with multilayer passive circuits, highly dense and more functional MMICs can be implemented.<>Keywords
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