Investigations into the use of Adhesives For Level-1 Microelectronic Interconnections
- 1 January 1989
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Microelectronics Packaging HandbookJournal of Electronic Packaging, 1989
- Thermal Stress in Bonded JointsIBM Journal of Research and Development, 1979