Characterization of Automated Wafer Inspection Tools
- 19 July 1989
- conference paper
- Published by SPIE-Intl Soc Optical Eng
- Vol. 1087, 180-188
- https://doi.org/10.1117/12.953091
Abstract
With some companies now ramping up production of the 4 Mbit DRAM, the era of submicron device technology has begun. To produce each new device with an acceptable yield, there is a requirement for a decrease in defect density in comparison to previous generations of technology as shown in the figure 1.© (1989) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.Keywords
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