Adhesion studies of magnetron-sputtered copper films on chemically etched nickel substrates: Effects of the concentration and the temperature of the bath
- 20 December 1989
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 182 (1-2) , 167-184
- https://doi.org/10.1016/0040-6090(89)90253-8
Abstract
No abstract availableKeywords
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