Multi-Chip and Bare Chip Packaging Technologies. Bare-Chip Technology Using Anisotropic Conductive Films.
Open Access
- 1 January 1997
- journal article
- Published by Japan Institute of Electronics Packaging in The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
- Vol. 12 (7) , 473-476
- https://doi.org/10.5104/jiep1995.12.473
Abstract
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