Directional and preferential sputtering-based physical vapor deposition
- 1 July 1995
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 263 (1) , 1-12
- https://doi.org/10.1016/0040-6090(95)06573-3
Abstract
No abstract availableThis publication has 27 references indexed in Scilit:
- The role of Cu distribution and Al2Cu precipitation on the electromigration reliability of submicrometer Al(Cu) linesJournal of Applied Physics, 1994
- Chemical Vapor Deposition of Copper for Multilevel MetallizationMRS Bulletin, 1993
- Electroless Cu for VLSIMRS Bulletin, 1993
- Planarization Mechanism of RF‐Biased Al SputteringJournal of the Electrochemical Society, 1993
- The angular dependence of preferential sputtering and composition in aluminum–copper thin filmsJournal of Vacuum Science & Technology A, 1989
- Angular dependence of preferential sputtering and composition in aluminum-copper thin filmsApplied Physics Letters, 1988
- Quantitative sputteringSurface and Interface Analysis, 1988
- Charged particle fluxes from planar magnetron sputtering sourcesJournal of Vacuum Science & Technology A, 1986
- The angular distribution of particles sputtered from Cu, Zr, and Au surfaces by ion bombardment at grazing incidenceNuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 1985
- Nonresonant multiphoton ionization as a sensitive detector of surface concentrations and evaporation ratesApplied Physics Letters, 1984