Dynamic Recrystallization in TiAl and Ti3Al Intermetallic Compounds

• 1 January 1993
• journal article
• Published by Trans Tech Publications, Ltd. in Materials Science Forum
• Vol. 113-115, 613-618
• https://doi.org/10.4028/www.scientific.net/msf.113-115.613

Abstract

Keywords

• DISLOCATION
• DYNAMIC RECRYSTALLIZATION (DRX)
• GRAIN BOUNDARY
• INTERMETALLIC COMPOUND (IMC)