Stress in metal lines under passivation; comparison of experiment with finite element calculations
- 29 April 1991
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 58 (17) , 1845-1847
- https://doi.org/10.1063/1.105075
Abstract
The elastic strain in Al‐0.5% Cu metal lines under silicon nitride passivation has been determined by x‐ray diffraction. The experimental stress tensor calculated from these strain values is in excellent agreement with the results of a finite element model calculation. The intrinsic stress in the dielectric plays no role in influencing the stress in the metal; only thermal stress effects are important.Keywords
This publication has 2 references indexed in Scilit:
- A study on stress-induced migration in aluminum metallization based on direct stress measurementsJournal of Vacuum Science & Technology B, 1990
- X-ray diffraction determination of the effect of various passivations on stress in metal films and patterned linesJournal of Applied Physics, 1990