Evaporated film profiles over steps in substrates
- 1 August 1970
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 6 (2) , 113-118
- https://doi.org/10.1016/0040-6090(70)90068-4
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Thermal effects on the integrity of aluminum to silicon contacts in silicon integrated circuitsIEEE Transactions on Electron Devices, 1969