Wetting behavior between solder and electroless nickel deposits
- 30 June 1994
- journal article
- Published by Elsevier in Materials Chemistry and Physics
- Vol. 38 (1) , 33-41
- https://doi.org/10.1016/0254-0584(94)90142-2
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
- Wettability of silicon carbide by aluminium, copper and silverJournal of Materials Science Letters, 1989
- Selective Electroless Metal Deposition for Via Hole Filling in VLSI Multilevel Interconnection StructuresJournal of the Electrochemical Society, 1989
- Growth kinetics of intermetallic phases at the liquid Sn and solid Ni interfaceScripta Metallurgica, 1980
- Tarnishing of Nickel in Air at Temperatures from 23° to 200°C and Relative Humidities from Ambient to 95%Journal of the Electrochemical Society, 1977
- The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead AlloysTransactions of the IMF, 1976
- Wetting under chemical equilibrium and nonequilibrium conditionsThe Journal of Physical Chemistry, 1974
- DTA and X-ray Studies of Electroless NickelJournal of the Electrochemical Society, 1967