Effect of Sn content of Pb-Sn solder alloys on wetting dynamics
- 1 August 1994
- journal article
- Published by Elsevier in Scripta Metallurgica et Materialia
- Vol. 31 (4) , 375-380
- https://doi.org/10.1016/0956-716x(94)90003-5
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Kinetics of wetting Ag substrates by 60Sn40PbScripta Metallurgica et Materialia, 1994
- Effects of Viscosities of Molten Solders and Fluxes on the SolderabilityJournal of the Japan Institute of Metals and Materials, 1981
- XIV.The surface tension of liquid metals.—Part V.The surface tension of the lead-tin alloysJournal of Computers in Education, 1934
- XXVIII.The surface tension of liquid metals.—Part I.Tin and leadJournal of Computers in Education, 1926