PN and SOI wafer flow process for stencil mask fabrication
- 23 April 1999
- proceedings article
- Published by SPIE-Intl Soc Optical Eng
- Vol. 3665, 20-30
- https://doi.org/10.1117/12.346224
Abstract
Two process flows for the fabrication of stencil masks have been developed. The PN Wafer Flow- and the SOI Wafer Flow Process. Membranes and stencil masks out of different 6 inch Si base wafers with 3 micrometers membrane thickness and a membrane diameter between 120 mm and 126 mm were fabricated. The membrane stress depending on the material property and doping level has been determined. First metrology measurements have been carried out.Keywords
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