Real Time Non-Destructive Evaluation in Ultrasonic Wire Bonding

• 1 January 1983
• conference paper
• Published by Institute of Electrical and Electronics Engineers (IEEE)
• p. 861-865
• https://doi.org/10.1109/ultsym.1983.198182

Abstract

Keywords

• WIRE
• RESONANCE
• FLANGES
• PIEZOELECTRIC TRANSDUCERS
• RESONANT FREQUENCY
• CLAMPS
• PATTERN RECOGNITION
• CIRCUITS
• BONDING FORCES
• VIBRATIONS