High-speed chip-to-chip optical interconnect

Abstract
An intraboard chip-to-chip optical interconnect has been demonstrated as a compatible and potentially manufacturable last step in the conventional multichip module process. Chip-to-chip optical communication at 1 Gb/s NRZ was achieved using an edge emitting laser, a flip-chip p-i-n photodetector and a photodefined polymer optical waveguide.

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