High-speed chip-to-chip optical interconnect
- 1 October 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Photonics Technology Letters
- Vol. 4 (10) , 1157-1159
- https://doi.org/10.1109/68.163764
Abstract
An intraboard chip-to-chip optical interconnect has been demonstrated as a compatible and potentially manufacturable last step in the conventional multichip module process. Chip-to-chip optical communication at 1 Gb/s NRZ was achieved using an edge emitting laser, a flip-chip p-i-n photodetector and a photodefined polymer optical waveguide.Keywords
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