Carbon Nanotubes for Interconnect Applications

Preprint

20 December 2004

preprint
Published by arXiv in arXiv

https://doi.org/10.48550/arXiv.cond-mat/0412537

Abstract

We briefly review the status of the application of carbon nanotubes (CNTs) for future interconnects and present results concerning possible integration schemes. Growth of single nanotubes at lithographically defined locations (vias) has been achieved which is a prerequisite for the use of CNTs as future interconnects. For the 20 nm node, a current density of 5 10^8 A/cm^2 and a resistance of 7.8 kOhm could be achieved for a single multi-walled CNT vertical interconnect.

Keywords

INTERCONNECT APPLICATIONS
FUTURE INTERCONNECTS
CARBON NANOTUBES
CURRENT DENSITY
BRIEFLY REVIEW
INTERCONNECTS
INTEGRATION
RESISTANCE
CNTS

All Related Versions

Version 1, 2004-12-20, ArXiv

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