Slope control of molybdenum lines etched with reactive ion etching

• 1 May 1990
• journal article
• Published by American Vacuum Society in Journal of Vacuum Science & Technology A
• Vol. 8  (3) , 1529-1532
• https://doi.org/10.1116/1.576869

Abstract

Keywords

• COMPUTER SIMULATION
• LOW PRESSURE
• AUGER ELECTRON SPECTROSCOPY
• REACTIVE ION ETCHING
• FLOW RATE
• SCANNING ELECTRON MICROSCOPY