Stub TLM modelling of heat flow in semiconductor devices
- 14 May 1986
- journal article
- Published by IOP Publishing in Journal of Physics D: Applied Physics
- Vol. 19 (5) , 721-725
- https://doi.org/10.1088/0022-3727/19/5/006
Abstract
Stub transmission lines can easily be introduced into existing TLM models for heat flow in semiconductor devices. They provide a convenient means of eliminating inter-nodal reflections that arise as a result of either geometric factors or the temperature dependence of the specific heat and thermal conductivity. Stub lines have been used to identify a minor error in a previously published TLM formulation.Keywords
This publication has 1 reference indexed in Scilit:
- A two-dimensional transmission line matrix model for heat flow in power semiconductorsJournal of Physics D: Applied Physics, 1985