Humidity Test of Premolded Chip Carriers

• 1 June 1981
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
• Vol. 4  (2) , 210-213
• https://doi.org/10.1109/tchmt.1981.1135788

Abstract

Keywords

• PACKAGES
• PREMOLDED CHIP CARRIER
• HUMIDITY TEST
• TEST CHIPS
• PLASTIC
• TESTING OF PREMOLDED