Adhesion measurement of thin metal films by scratch, peel, and pull methods

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Abstract
Scratch, peel, and pull methods for adhesion measurement were applied to deposited thin film/solid substrate combinations. Scatter in the experimental data was observed and its origin is discussed. The interface between the thin film and the substrate was investigated by transmission electron microscopy (TEM), energy dispersive spectroscopy (EDS), and Auger electron spectroscopy (AES), and the correlation of the interface structure with the adhesion strength was investigated. Ion bombardment and heat treatment were carried out to enhance the adhesion. Accumulation of bombarding gas ions at the interface was observed and the role of ion bombardment in improving adhesion is considered.

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