Optimization of alignability in integrated planar-optical interconnect packages

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Abstract
The efficiency of power transfer and the alignability of an integrated planar-optics holographic optical backplane for board-to-board interconnections are analyzed. Both the efficiency and the alignability are functions of lateral and angular offsets in the input, the error in the spatial frequency of the hologram, errors in the source wavelength, the distance between two boards, the thickness of the substrate, the sizes of the hologram and the beam spot, and the angle of propagation of the beam. From the analyses, design guidelines on integrated planar-optic interconnects are developed, and it is shown that the interconnect design can be optimized for maximum alignability. A design with optimum alignability may not have the highest possible peak efficiency, but it can tolerate greater offsets without a substantial efficiency decrease.