New thermal fatigue life prediction method for BGA/FBGA solder joints with basic crack propagation study
- 25 June 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Low cycle fatigue of surface mounted chip carrier/printed wiring board jointsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Nonlinear finite element simulation of thermoviscoplastic deformation of C4 solder joints in high density packaging under thermal cyclingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With UnderfillJournal of Electronic Packaging, 1999
- Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering ApproachJournal of Electronic Packaging, 1995
- Thermal fatigue life of Pb-Sn alloy interconnectionsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
- Isothermal Fatigue of 63Sn-37Pb SolderJournal of Electronic Packaging, 1990
- Fatigue crack propagation behavior of 63Sn-37Pb solderScripta Metallurgica, 1989
- A creep-rupture model for two-phase eutectic soldersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Thermal Fatigue Damage in Pb - In Solder Interconnections8th Reliability Physics Symposium, 1985