Ductility and Rheology of an Al-4.5% Cu Alloy from Room Temperature to Coherency Temperature
- 2 May 1996
- journal article
- Published by Trans Tech Publications, Ltd. in Materials Science Forum
- Vol. 217-222, 1209-1214
- https://doi.org/10.4028/www.scientific.net/msf.217-222.1209
Abstract
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