Sputtered Ni-Cr-based resistors terminated on sputtered aluminum and screeen-printed Pt-Ag conductors
- 1 December 1986
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 145 (1) , 1-15
- https://doi.org/10.1016/0040-6090(86)90246-4
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Properties of evaporated Ni-Cr films with an aluminum content of about 50%Thin Solid Films, 1985
- Plasmatron sputtering for the production of high stability NiCr resistive filmsThin Solid Films, 1984
- Resistance, temperature coefficient of resistance and long-term stability of annealed thin NiCrSi filmsThin Solid Films, 1984