A parametric elastic model for indentation testing of thin films
- 14 December 1993
- journal article
- Published by IOP Publishing in Journal of Physics D: Applied Physics
- Vol. 26 (12) , 2123-2131
- https://doi.org/10.1088/0022-3727/26/12/005
Abstract
Describes a parametric model designed to predict the true contact radius and distance of approach when a spherical indenter is loaded against a thin film attached to a substrate. The model is elastic, i.e. no plastic deformation within either the film or the substrate is allowed for, and is valid for perfect adhesion between the film and the substrate. Predictions from the model, for soft films on hard substrates, are compared with experimental measurements, showing generally good agreement. Predictions are also made for hard films on softer substrates, although no comparison with experiment is made. The use of the model for low load indentation testing is discussed, in particular its value for determining the load levels for which measured material properties are truly those of the film, being independent of the substrate.Keywords
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