The chemical analysis of TiN films: A round robin experiment
- 1 October 1987
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 153 (1-3) , 169-183
- https://doi.org/10.1016/0040-6090(87)90180-5
Abstract
No abstract availableThis publication has 20 references indexed in Scilit:
- Practical surface analysis: state of the art and recent developments in AES, XPS, ISS and SIMSSurface and Interface Analysis, 1986
- Variations in the colour of group IV B nitride filmsVacuum, 1986
- The stress in ion-plated HfN and TiN coatingsThin Solid Films, 1985
- Quantitative auger electron analysis of titanium nitridesSurface Science, 1985
- X-ray photoelectron and Auger-electron forward scattering: A new tool for studying epitaxial growth and core-level binding-energy shiftsPhysical Review B, 1984
- Kinetics of nitride formation on titanium targets during reactive sputteringSurface Science, 1983
- Mechanisms of reactive sputtering of titanium nitride and titanium carbide I: Influence of process parameters on film compositionThin Solid Films, 1983
- Applications of TiN thin films in silicon device technologyThin Solid Films, 1982
- Angular effects in Auger electron emission from Cu (110)Solid State Communications, 1976
- High-Resolution X-Ray Photoemission Spectrum of the Valence Bands of GoldPhysical Review B, 1972