Copper electroless deposition technology for ultra-large-scale-integration (ULSI) metallization
Open Access
- 1 January 1997
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 33 (1-4) , 47-58
- https://doi.org/10.1016/s0167-9317(96)00030-5
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Electroless copper deposition for ULSIThin Solid Films, 1995
- Selective electroless copper for VLSI interconnectionIEEE Electron Device Letters, 1989
- Plating of Copper into Through‐Holes and ViasJournal of the Electrochemical Society, 1989