Alternative approach to electroless Cu metallization of AlN by a nonaqueous polyol process
- 28 April 1997
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 70 (17) , 2315-2317
- https://doi.org/10.1063/1.118847
Abstract
Cu metallization of AlN substrates was performed using a nonaqueous, electroless, alcohol based approach known as the polyol method. The concentration of O in the film depended on the orientation of the substrates during deposition. This approach is very attractive for metallizing electronic substrates which are susceptible to hydrolytic degradation.
Keywords
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