Mechanism for AlSiCu Alloy Corrosion
- 1 June 1992
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 31 (6S) , 2045
- https://doi.org/10.1143/jjap.31.2045
Abstract
We investigated corrosion at AlSiCu/TiN interconnection lines in VLSI devices. This type of corrosion appeared during the deionized water rinse treatment after the dry etching and ashing treatment (with O2+CF4 gas mixture). The corrosion shape was “pitlike”. When added the vacuum heating treatment before the deionized water rinse, the corrosion number was decreased. However, the ashing treatment had a contrary effect for this type of corrosion suppression. We investigated this type of corrosion mechanism by ion-chromatography analysis. In this analysis, residual Cl concentration decreased when the ashing time was prolonged, but the corrosion number was increased significantly. We measured residual F concentration at the same time, and detected a high concentration of F- ions. We consider that these F- ions contribute to this type of corrosion.Keywords
This publication has 1 reference indexed in Scilit:
- Reactive ion etching induced corrosion of Al and Al-Cu filmsJournal of Applied Physics, 1981