Uniform Ultra-Thin Pb(Zr,Ti)O3 Films Formed by Metal-Organic Chemical Vapor Deposition and Their Electrical Characteristics

Abstract
Lead zirconate titanate ( Pb(Zr,Ti)O3) thin films were deposited on Pt films sputtered on thermally oxidized silicon wafers by metal-organic chemical vapor deposition (MOCVD). The films were less than 100 nm thick (typically 80 nm), thin enough for use in LSI semiconductor memories. The films were characterized by inductive coupling plasma mass spectroscopy and X-ray diffraction. Electrical measurements revealed that the films had good ferroelectric characteristics, with a low coercive voltage of 0.7 V. In addition, the non-switching dielectric characteristics for application to dynamic random access memory (DRAM) were equivalent to those of 0.4 nm of SiO2 with small leakage current.