Adhesion, phase morphology, and bondability of reacttvely-bonded and frit-bonded gold and silver thick-film conductors
- 1 May 1974
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 3 (2) , 553-577
- https://doi.org/10.1007/bf02652957
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Influence of metallic diffusion on the adhesion of screen printed silver filmsMetallurgical Transactions, 1970
- Oxide-oxide interactions studied by transmission electron microscopyJournal of Materials Science, 1967
- The System Copper Oxide—AluminaJournal of the American Ceramic Society, 1963