Electromigration Testing of via Terminated Test Structures
- 1 January 1999
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Observations of electromigration induced void nucleation and growth in polycrystalline and near-bamboo passivated Al linesJournal of Applied Physics, 1995
- Computer simulation of electromigration in thin-film metal conductorsJournal of Applied Physics, 1994