A refractory lift-off process with applications to high-T c superconducting circuits
- 15 December 1978
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 33 (12) , 1034-1035
- https://doi.org/10.1063/1.90258
Abstract
A refractory stencil lift‐off process utilizing Nb/Cu bilayers is described that is suitable for materials, such as the high‐transition‐temperature superconductors, which must be deposited on hot (up to 1000 °C) substrates.Keywords
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