Thermal and Physical Properties and Etching Characteristics of PI Films

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Abstract
The thermal properties of spin‐coated polyimide films and their etching characteristics are evaluated. The physical properties of polyimide films are presented, such as density, softening temperature, thickness, and wet etching characteristics which change with curing temperature. Wet etching characteristics, such as the etch rate and the pattern profile, are influenced not only by the imidization, but also by the molecular state of aggregation. When the crystallinity is chosen as the physical parameter, the wet etching characteristics closely correspond to the crystallinity. Desirable patterns of polyimide films can be obtained when the crystallinity is about 10%.

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