Electromigration Evaluation - MTF Modeling and Accelerated Testing
- 1 April 1984
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium
- No. 07350791,p. 264-272
- https://doi.org/10.1109/irps.1984.362057
Abstract
Fail times and activation energies were determined to vary widely for different metal compositions. General results indicate that temperature, current density and grain size are the most dominant factors that affect electromigration behavior for the various metal compositions. The technique of using changes in metal stripe resistance to predict the time of failure was evaluated.Keywords
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