Relaxations of thermosets. III. Sub‐Tg dielectric relaxations of bisphenol‐A–based epoxide cured with different cross‐linking agents
- 15 January 1990
- journal article
- research article
- Published by Wiley in Journal of Polymer Science Part B: Polymer Physics
- Vol. 28 (1) , 71-83
- https://doi.org/10.1002/polb.1990.090280106
Abstract
No abstract availableKeywords
This publication has 26 references indexed in Scilit:
- Dielectric studies of the effects of thermal history on secondary relaxation in bisphenol‐a‐polycarbonateJournal of Polymer Science Part B: Polymer Physics, 1989
- The effect of water on dielectric relaxations in the glassy states of poly(propylene oxide) and propylene glycolPolymer, 1988
- Dynamic mechanical behaviour and its dependence on preparation method of structural epoxide resinPolymer, 1987
- Mechanical and dielectric relaxations of epoxide resins containing the spiro‐ring structure. II. Effect of the introduction of methoxy branches on low‐temperature relaxations of epoxide resinsJournal of Polymer Science Part B: Polymer Physics, 1987
- A kinetic model for curing reactions of epoxides with aminesPolymer Engineering & Science, 1987
- Effect of thermal history on secondary relaxation processes in amorphous polymersPolymer, 1987
- The physical properties of bisphenol‐A‐based epoxy resins during and after curingJournal of Polymer Science Part B: Polymer Physics, 1986
- Mechanism of physical aging in crystalline polymersPolymer, 1980
- Effect of simultaneous polyaddition reaction on the curing of epoxidesJournal of Polymer Science: Polymer Chemistry Edition, 1980
- Structure of a typical amine‐cured epoxy resinJournal of Polymer Science Part A-2: Polymer Physics, 1970