An electrochemical AFM study on electrodeposition of copper on p-GaAs(100) surface in HCl solution
- 31 July 1995
- journal article
- Published by Elsevier in Electrochimica Acta
- Vol. 40 (10) , 1345-1351
- https://doi.org/10.1016/0013-4686(95)00070-u
Abstract
No abstract availableKeywords
This publication has 40 references indexed in Scilit:
- In Situ Atomic Force Microscopy Study of the Plating and Stripping of SilverJournal of the Electrochemical Society, 1994
- Etching of Silicon in NaOH Solutions: I . In Situ Scanning Tunneling Microscopic Investigation of n‐Si(111)Journal of the Electrochemical Society, 1993
- An in situ scanning tunneling microscopy study of the initial stages of bulk copper deposition on gold(100): the rim effectLangmuir, 1992
- In Situ STM Imaging of Silicon(111) in HF under Potential ControlJournal of the Electrochemical Society, 1992
- Atomic resolution images of H-terminated Si(111) surfaces in aqueous solutionsApplied Physics Letters, 1992
- In situobservation of monolayer structures of underpotentially deposited Hg on Au(111) with the atomic force microscopePhysical Review Letters, 1992
- I n s i t u, real-time monitoring of electrode surfaces by scanning tunneling microscopy. III. Surface structure of Pt and Pd electrodesJournal of Vacuum Science & Technology A, 1990
- Silver electrocrystallization—a model for partial activityElectrochimica Acta, 1988
- Imaging of n ‐ TiO2 by STM: Etching Effects on Photoelectrochemistry and Surface StructureJournal of the Electrochemical Society, 1988
- The Influence of Surface Recombination and Trapping on the Cathodic Photocurrent at p‐Type III‐V ElectrodesJournal of the Electrochemical Society, 1982