Thermal modeling of high performance packages in portable computers
- 19 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- Heat transfer in a low aspect ratio horizontal enclosure for laptop computer applicationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Application of CFD Technology to electronic thermal managementPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Thermal modelling of the Pentium processor packagePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Development, validation and application of a thermal model of a plastic quad flat packPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic CoolingJournal of Electronic Packaging, 1995
- Combined Conduction, Natural Convection, and Radiation Heat Transfer in an Electronic ChassisJournal of Electronic Packaging, 1991
- Natural Convection Cooling of a Horizontally Oriented Component Board Mounted in a Low-Aspect-Ratio EnclosureJournal of Electronic Packaging, 1991
- Instability, Transition, and Turbulence in Buoyancy-Induced FlowsAnnual Review of Fluid Mechanics, 1973
- Stability of Thin Non-Rotating Hadley CirculationsJournal of the Atmospheric Sciences, 1972
- Patterns of free convection flow adjacent to horizontal heated surfacesInternational Journal of Heat and Mass Transfer, 1968