Co-sputtered TiB2 as a diffusion barrier for advanced microelectronics with Cu metallization
- 1 October 1995
- journal article
- Published by Elsevier in Applied Surface Science
- Vol. 91 (1-4) , 263-268
- https://doi.org/10.1016/0169-4332(95)00129-8
Abstract
No abstract availableKeywords
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