The effect of test structure and stress condition on electromigration failure
- 1 January 1996
- proceedings article
- Published by AIP Publishing in AIP Conference Proceedings
- Vol. 373 (1) , 185-197
- https://doi.org/10.1063/1.50943
Abstract
A series of electromigration experiments has been performed using various test structures to investigate the effect of the test structure and stress condition on electromigration failures. It was found that electromigration failures were significantly influenced by both test structure and stress condition. Some issues in electromigration lifetime prediction are also discussed.Keywords
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