Energy Dissipation and Path Instabilities in Dynamic Fracture of Silicon Single Crystals

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Abstract
Brittle fracture usually proceeds at crack driving forces which are larger than those needed to create the new fracture surfaces. This surplus can lead to faster crack propagation or to the onset of additional dissipation mechanisms. Dynamic fracture experiments on silicon single crystals reported here show several distinct transitions between different dissipation mechanisms. Cleavage fracture is followed by the propagation of a faceted crack front, which is finally followed by a path instability and the propagation of multiple cracks. The fracture surface qualitatively corresponds to the mirror, mist, and hackle morphology of amorphous materials. However, the corresponding fracture mechanisms, which remain largely unknown in the amorphous materials, can clearly be identified here.

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