Trends in Packaging Technology

• 1 April 1978
• conference paper
• Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium
• No. 07350791,p. 127-129
• https://doi.org/10.1109/irps.1978.362834

Abstract

Keywords

• SEMICONDUCTOR DEVICE PACKAGING
• INTEGRATED CIRCUIT INTERCONNECTIONS
• PINS
• ELECTRONICS PACKAGING
• COSTS
• LARGE SCALE INTEGRATION
• CHIP SCALE PACKAGING
• SUBSTRATES
• INTEGRATED CIRCUIT RELIABILITY
• PRODUCTION