Low dielectric material for multilayer printed wiring boards
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (4) , 1115-1120
- https://doi.org/10.1109/33.62560
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Characterization of brominated poly(4-hydroxystyrene) derivatives containing unsaturated groupsPolymer, 1990
- The Curing Reaction and Glass Transition Temperature of Maleimide Resin Containing Epoxy GroupsPolymer Journal, 1988
- Thermal degradation of poly(bismaleimides)Journal of Polymer Science: Polymer Chemistry Edition, 1976
- Polyaspartimides: Condensation of aromatic diamines and bismaleimide compoundsJournal of Polymer Science: Polymer Chemistry Edition, 1973