Sur I'oxydation sèche du cuivre et de ses alliages II.‐Etude de I'oxydation isotherme du cuivre pur

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Abstract
This paper deals with the kinetics of thermal oxidation, in pure oxygen at atmospheric pressure, of electrolytically polished copper at 173° C and 247° C. These temperatures were chosen so as to be on either sides of 224° C, because previous work had chosen that this temperature coincided with the appearance of cupric oxide in the films. It was confirmed in the present paper that cupric oxide is a product of the oxidation of cuprous oxide and not of the copper itself. The oxidation of cuprous oxide only starts when the latter is sufficiently thick (circa 2,500 Å). It was also confirmed that films containing cupric oxide are much less adherent than those of pure suprous oxide.

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