Electromigration of Grain Boundaries in Aluminium (99.995%)
- 16 February 1975
- journal article
- research article
- Published by Wiley in Physica Status Solidi (a)
- Vol. 27 (2) , 383-391
- https://doi.org/10.1002/pssa.2210270209
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Electromigration of polygonization substructures in aluminiumJournal of Materials Science, 1973
- Theory of grain boundary grooving under the combined action of the surface and volume diffusion mechanismsActa Metallurgica, 1973
- Current-induced mass transport in aluminumJournal of Physics and Chemistry of Solids, 1964
- Measurements of Equilibrium Vacancy Concentrations in AluminumPhysical Review B, 1960
- Measurements of the High-Temperature Electrical Resistance of Aluminum: Resistivity of Lattice VacanciesPhysical Review B, 1960
- The effect of thermal grooving on grain boundary motionActa Metallurgica, 1958
- Theory of Thermal GroovingJournal of Applied Physics, 1957