Semiconductor technology crisis and challenges towards the year 2000

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Abstract
Continuing device miniaturization results in higher packing density and higher fabrication cost, thus requires high ROI products utilizing complex design capability. Usually complex design requires higher abstraction in order to cope with the design scale, on the other hand, because of the critical device characteristics and interconnect phenomena, technology dependent design is also necessary. In addition to performance and crosstalk requirement, power limitation including electromigration should be appropriately simulated. Packaging is another important differentiater and large cost factor. Testing is now often a critical path, and also suffering from cost burden. It should be noted that testing is a part of the design effort, but limits manufacturability considerably. Semiconductor vendors will become more and more solution providers rather than component suppliers, thus should cover system level design to all way down to manufacturing in various different segments. However, a single company can never achieve such a goal alone, that is why vertical and horizontal alliances have started to make sense. The answer to the challenges are global standardizations and alliance/partnership models in various different manners.

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