Electrodeposition and Nucleation of Copper at Nitrogen-Incorporated Tetrahedral Amorphous Carbon Electrodes in Basic Ambient Temperature Chloroaluminate Melts
- 1 January 2001
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 148 (3) , C183-C190
- https://doi.org/10.1149/1.1346608
Abstract
The electrodeposition of copper on the atomically smooth nitrogen-incorporated tetrahedral amorphous carbon (taC:N) electrode has been studied in basic ambient temperature AlCl3/1ethyl3methylimidazoliumAlCl3/1ethyl3methylimidazolium chloroaluminate melts. A high overpotential for nucleation of copper on taC:N and no underpotential deposition features are observed, comparable to the behavior of boron-doped diamond electrodes. Electrochemical deposition and stripping of copper on taC:N show that most of the deposit is anodically dissolved only when the potential reaches that of Cu(I) oxidation in a system in which Cu(I) and Cu(II) are both stable. The low density of intrinsic active sites for nucleation and its early saturation with increasing overpotential are responsible for the slight deviation from a model of the ideal progressive type of nucleation at high overpotentials. © 2001 The Electrochemical Society. All rights reserved.Keywords
This publication has 45 references indexed in Scilit:
- Aluminum Deposition and Nucleation on Nitrogen-Incorporated Tetrahedral Amorphous Carbon Electrodes in Ambient Temperature Chloroaluminate MeltsJournal of the Electrochemical Society, 2000
- Electrochemical reduction of Cu2+ without surface trapping on synthetic conductive diamond electrodesChemical Physics Letters, 1999
- Electrodes of Nitrogen-Incorporated Tetrahedral Amorphous Carbon A Novel Thin-Film Electrocatalytic Material with Diamond-like StabilityElectrochemical and Solid-State Letters, 1999
- Cathodic and Anodic Deposition of Mercury and Silver at Boron‐Doped Diamond ElectrodesJournal of the Electrochemical Society, 1999
- Electrochemical Scanning Tunneling Microscopy Investigation of HOPG and Silver Electrodeposition on HOPG from the Acid Room-Temperature Molten Salt Aluminum Chloride−1-Methyl-3-butyl-imidazolium ChlorideThe Journal of Physical Chemistry B, 1998
- Electrochemistry at boron-doped diamond films grown on graphite substrates: redox-, adsorption and deposition processesJournal of Electroanalytical Chemistry, 1998
- Mechanical properties and Raman spectra of tetrahedral amorphous carbon films with high sp3 fraction deposited using a filtered cathodic arcPhilosophical Magazine Part B, 1997
- Electron spectroscopy study of the silver-diamond(100)-H interfaceApplied Physics Letters, 1996
- Electrodeposition of Metal Adlayers on Boron‐Doped Diamond Thin‐Film ElectrodesJournal of the Electrochemical Society, 1995
- Electrochemical studies in low temperature molten salt systems containing alumnium chlorideJournal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1981